The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2013
Filed:
Feb. 01, 2008
Tetsuji Ohta, Tokyo, JP;
Keiko Kitamura, Saitama, JP;
Mitsuhiro Watanabe, Yokosuka, JP;
Kimoto Co., Ltd., , JP;
Abstract
A material for forming electroless plate comprising a non-conductive base material and a catalyst adhering layer provided on the non-conductive base material is constituted so that the catalyst adhering layer should comprise a hydrophilic (meth)acrylic resin constituted with a hydrophilic monomer and a hydrophobic monomer and containing the hydrophobic monomer at a ratio of 50 to 90 mol %. This material for forming electroless plate shows favorable catalyst adhering property, and shows no delamination of the catalyst adhering layer from the non-conductive base material, no dissolution of the catalyst adhering layer into a plating solution, and no discoloration of plate layer during the catalyst adhering step, development step and other steps.