The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2013

Filed:

Aug. 25, 2010
Applicants:

Atsushi Sato, Tokyo, JP;

Hisayuki Abe, Tokyo, JP;

Takashi Ota, Tokyo, JP;

Miyuki Yanagida, Tokyo, JP;

Masumi Kameda, Tokyo, JP;

Inventors:

Atsushi Sato, Tokyo, JP;

Hisayuki Abe, Tokyo, JP;

Takashi Ota, Tokyo, JP;

Miyuki Yanagida, Tokyo, JP;

Masumi Kameda, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a terminal structureincluding a terminalhaving a conductorcontaining at least one metal selected from the group consisting of gold, silver, and copper, a first layer containing phosphorus and nickel disposed on the conductor, and a second layer having a nickel/phosphorus atomic ratio smaller than that of the first layer and containing NiP disposed on the first layer; and solderdisposed on the second layer of the terminal, while the second layer has a thickness of at least 0.35 μm; and a module substratehaving the terminal structure.


Find Patent Forward Citations

Sato, Atsushi. (2013). Terminal structure, printed wiring board, module substrate, and electronic device (U.S. Patent No. 8383964). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8383964

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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