The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2013
Filed:
Apr. 05, 2012
Mikako Okada, Tokyo, JP;
Toshikazu Ishikawa, Tokyo, JP;
Mikako Okada, Tokyo, JP;
Toshikazu Ishikawa, Tokyo, JP;
Renesas Electronics Corporation, Kawasaki-shi, JP;
Abstract
A multilayer wiring substrate has an upper surface with multiple bonding leads and a lower surface with multiple lands. Multiple wiring layers and insulating layers are alternately formed on the upper surface side and on the lower surface side of the core material of the wiring substrate. The bonding leads are formed of part of the uppermost wiring layer and the lands are formed of part of the lowermost wiring layer. The insulating layers include second insulating layers containing fiber and resin and third insulating layers smaller in fiber content than the second insulating layers. The second insulating layers are formed on the upper and lower surface sides of the core material. The third insulating layers are formed on the upper and lower surface sides of the core material with the second insulating layers in-between. The uppermost and lowermost wiring layers are formed over the third insulating layers.