The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2013

Filed:

Feb. 04, 2010
Applicants:

John Allen Manifold, Milan, IN (US);

Joshua Thomas Fung, Cincinnati, OH (US);

Jeremy Howard Nugent, Liberty Township, OH (US);

Ashley Lynn Kuntz, Cincinnati, OH (US);

Katie Kristine Glass, Hamilton Township, OH (US);

Kathryn Christian Kien, Cincinnati, OH (US);

Kevin Mitchell Wiwi, West Chester, OH (US);

Inventors:

John Allen Manifold, Milan, IN (US);

Joshua Thomas Fung, Cincinnati, OH (US);

Jeremy Howard Nugent, Liberty Township, OH (US);

Ashley Lynn Kuntz, Cincinnati, OH (US);

Katie Kristine Glass, Hamilton Township, OH (US);

Kathryn Christian Kien, Cincinnati, OH (US);

Kevin Mitchell Wiwi, West Chester, OH (US);

Assignee:

The Procter & Gamble Company, Cincinnati, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 5/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

Fibrous structures that exhibit a Dry Burst of greater than 100 g and a Cross-Machine Direction Flexural Rigidity (CD Flexural Rigidity) of greater than 56 mg*cm/cm as measured according to the Flexural Rigidity Test Method and/or a Total Dry Tensile (TT or TDT) of less than 3000 g/76.2 mm as measured according to the Tensile Strength Test Method and/or a Geometric Mean Tensile (GM Tensile or GMT) of less than 750 g/76.2 mm as measured according to the Tensile Strength Test Method and/or a Machine Direction Modulus (MD Modulus) of less than 900 g/cm as measured according to the Modulus Test Method are provided.


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