The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2013

Filed:

Aug. 29, 2007
Applicants:

Tadao Yamamoto, Hamura, JP;

Kaoru Saito, Hamura, JP;

Naotomo Miyamoto, Hamura, JP;

Masaharu Shioya, Hamura, JP;

Toshihiro Hashimoto, Kirishima, JP;

Masaaki Miyahara, Kirishima, JP;

Atsushi Ogasawara, Kirishima, JP;

Ryuji Mori, Kirishima, JP;

Inventors:

Tadao Yamamoto, Hamura, JP;

Kaoru Saito, Hamura, JP;

Naotomo Miyamoto, Hamura, JP;

Masaharu Shioya, Hamura, JP;

Toshihiro Hashimoto, Kirishima, JP;

Masaaki Miyahara, Kirishima, JP;

Atsushi Ogasawara, Kirishima, JP;

Ryuji Mori, Kirishima, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J 7/00 (2006.01); C01B 6/24 (2006.01); C01B 3/02 (2006.01); B01J 10/00 (2006.01); B01J 8/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a reaction apparatus having an enhanced connection, and a fuel cell system and an electronic device that include such a reaction apparatus. A reaction apparatus () a reformer () in which a reforming reaction chamber () is formed, a CO remover in which a removing reaction chamber () where a chemical reaction is performed at a temperature lower than that in the reforming reaction chamber () is formed, and a connecting portion () having a communicating path that communicates between the reforming reaction chamber () and the removing reaction chamber (). The reformer () and the CO remover () are arranged spaced apart from each other, at least one of which () is configured by combining ceramic parts () and metal components (), and the ceramic parts () and the metal components () are connected with connecting members () interposed therebetween. The connecting members () have thermal conductivities higher than those of the ceramic parts ().


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