The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2013
Filed:
Mar. 27, 2009
Takayuki Nishiura, Itami, JP;
Yoshio Mezaki, Itami, JP;
Yoshiki Yabuhara, Itami, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
Affords a compound semiconductor substrate packaging method for preventing oxidation of the surface of compound semiconductor substrates. The compound semiconductor substrate packaging method provides: a first step of inserting a compound semiconductor substrate () into a gas-permeable, rigid container (), placing the rigid container () into an inner-packing pouch () having an oxygen transmission rate of 1 to 100 ml·m·day·atm, and a moisture transmission rate of 1 to 15 g·m·day, replacing the air inside the inner-packing pouch () with an inert gas, and hermetically sealing the inner-packing pouch; and a second step of placing the sealed inner-packing pouch (), and a deoxygenating/dehydrating agent () that at least either absorbs or adsorbs oxygen gas and moisture, into an outer-packing pouch () that has an oxygen transmission rate that is 5 ml·m·day·atmor less and is lower than that of the inner-packing pouch (), and a moisture transmission rate that is 3 g·m·dayor less and is lower than that of the inner-packing pouch (), and hermetically sealing the outer-packing pouch ().