The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Jul. 29, 2011
Hisayoshi Watanabe, Tokyo, JP;
Yuji Matsuura, Tokyo, JP;
Takayuki Nishizawa, Tokyo, JP;
Masashi Sano, Tokyo, JP;
Tetsuji Hori, Tokyo, JP;
Hisayoshi Watanabe, Tokyo, JP;
Yuji Matsuura, Tokyo, JP;
Takayuki Nishizawa, Tokyo, JP;
Masashi Sano, Tokyo, JP;
Tetsuji Hori, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
The present invention relates to a method of forming a metal in a concave portion of a substrate. The method includes a step of preparing a substrate having a concave portion; a step of applying a liquid coating member on the substrate and filling in and solidifying the concave portion with the coating member; a step of covering the coating member with a resist; a step of forming a penetrating hole that penetrates the resist in a position of the concave portion of the substrate; a step of removing the coating member within the concave portion; and a step of filling a metal into a portion where the coating member has been removed.