The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Oct. 16, 2008
Koso Matsuno, Osaka, JP;
Atsushi Yamaguchi, Osaka, JP;
Shigeaki Sakatani, Osaka, JP;
Hidenori Miyakawa, Osaka, JP;
Mikiya Ueda, Osaka, JP;
Koso Matsuno, Osaka, JP;
Atsushi Yamaguchi, Osaka, JP;
Shigeaki Sakatani, Osaka, JP;
Hidenori Miyakawa, Osaka, JP;
Mikiya Ueda, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
In order to easily inject underfill resin and perform molding with reliability, groove sections are formed on a surface of a circuit board such that the ends of the groove sections extend to semiconductor elements. Low-viscosity underfill resin applied dropwise is guided by the groove sections and flows between the circuit board and the semiconductor elements. The underfill resin hardly expands to regions outside the semiconductor elements.