The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Sep. 08, 2009
Applicants:
Chie Fujioka, Kyoto, JP;
Toshiyuki Yokoe, Osaka, JP;
Daichi Kumano, Kyoto, JP;
Inventors:
Assignee:
Panasonic Corporation, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
Retaining regionsandare added to a pad shaped portionof leads and a die padthat are electrically connected via a conductive ribbon, so that during the bonding of the ribbon, strong ultrasonic waves can be applied in a state in which the retaining regionsandare pressed and fixed. It is therefore possible to reduce a resistance at a joint while firmly bonding the conductive ribbon. Further, the bonding strength of the conductive ribbonincreases and thus it is possible to eliminate the need for stacking the conductive ribbonsand easily reduce a stress caused by ultrasonic waves on a semiconductor chip