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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8378347 B1

PDFFull Text
Date of Patent:
Feb. 19, 2013

Filed:

Nov. 04, 2011

Led package

Applicants:

Satoshi Shimizu, Fukuoka-ken, JP;

Kazuhisa Iwashita, Fukuoka-ken, JP;

Teruo Takeguchi, Fukuoka-ken, JP;

Tetsuro Komatsu, Fukuoka-ken, JP;

Hiroaki Oshio, Fukuoka-ken, JP;

Tatsuo Tonedachi, Fukuoka-ken, JP;

Naoya Ushiyama, Fukuoka-ken, JP;

Kazuhiro Inoue, Fukuoka-ken, JP;

Gen Watari, Fukuoka-ken, JP;

Inventors:

Satoshi Shimizu, Fukuoka-ken, JP;

Kazuhisa Iwashita, Fukuoka-ken, JP;

Teruo Takeguchi, Fukuoka-ken, JP;

Tetsuro Komatsu, Fukuoka-ken, JP;

Hiroaki Oshio, Fukuoka-ken, JP;

Tatsuo Tonedachi, Fukuoka-ken, JP;

Naoya Ushiyama, Fukuoka-ken, JP;

Kazuhiro Inoue, Fukuoka-ken, JP;

Gen Watari, Fukuoka-ken, JP;

Assignee:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Attorney:

Turocy & Watson, LLP

Primary Examiner:

Olik Chaudhuri

Assistant Examiner:

Wilner Jean Baptiste

Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 21/329 (2006.01); H01L 21/56 (2006.01); H01L 21/58 (2006.01); H01L 21/60 (2006.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
Abstract

According to one embodiment, an LED package includes first and second lead frames spaced from each other, and an LED chip. Each of the first and second lead frames includes a base portion and a plurality of extending portions extending from the base portion. A part of a lower surface of the base portion, side surfaces of the base portion, lower surfaces of the extending portions and side surfaces of the extending portions are covered by resin. A remaining part of the lower surface of the base portion and tip surfaces of the extending portions are not covered by resin. The part of the lower surface of the base portion includes a first edge of the first lead frame and a second edge of the second lead frame. The first edge and the second edge are opposed each other.

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