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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8377797 B1

PDFFull Text
Date of Patent:
Feb. 19, 2013

Filed:

Jul. 27, 2010

Method for bonding of semiconductor component to a substrate

Applicants:

Aland K. Chin, Sharon, MA (US);

Jonah H. Jacob, Brookline, MA (US);

Maciej Thomas Knapczyk, Cambridge, MA (US);

Inventors:

Aland K. Chin, Sharon, MA (US);

Jonah H. Jacob, Brookline, MA (US);

Maciej Thomas Knapczyk, Cambridge, MA (US);

Assignee:

Science Research Laboratory, Inc., Somerville, MA (US);

Attorneys:

Burns & Levinson LLP

Jerry Cohen

Orlando Lopez

Primary Examiner:

A Sefer

Int. Cl.
CPC ...
H01L 21/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of attaching a semiconductor component to a heat-sink where the component is first placed onto a heat-sink substrate whose attachment surface comprises a malleable-metal film, a semiconductor component is placed onto the malleable-metal film, and pressure and heat is applied for a predetermined time to the stack including substrate with malleable-metal film and semiconductor component.

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Chin, Aland. (2013). Method for bonding of semiconductor component to a substrate (U.S. Patent No. 8377797). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8377797

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