The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Aug. 17, 2009
Kanji Sekihara, Toyokawa, JP;
Takehiko Goshima, Kunitachi, JP;
Kanji Sekihara, Toyokawa, JP;
Takehiko Goshima, Kunitachi, JP;
Konica Minolta Opto, Inc., Tokyo, JP;
Abstract
A die () is provided with: a cavity which can contain a molten resin; a micro-structure () provided on a molding transfer surface () forming the cavity such that the fine structure protrudes to the cavity side from the molding transfer surface (); and a anti-shrinkage convex section () protruding higher than the micro-structure () to the cavity side from one surface. A molten resin is applied to the die () and the surface of the die is relatively removed in the order of the micro-structure () and the anti-shrinkage convex section () from a resin substrate () formed by solidifying the resin.