The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Oct. 14, 2010
Applicants:
Koyu Ota, Hida, JP;
Touru Kurimoto, Hida, JP;
Yoshiaki Uwazumi, Hida, JP;
Koichi Miyake, Ageo, JP;
Katsuhiko Yoshimaru, Tokyo, JP;
Inventors:
Koyu Ota, Hida, JP;
Touru Kurimoto, Hida, JP;
Yoshiaki Uwazumi, Hida, JP;
Koichi Miyake, Ageo, JP;
Katsuhiko Yoshimaru, Tokyo, JP;
Assignee:
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/08 (2006.01);
U.S. Cl.
CPC ...
Abstract
Copper powder is provided, which, while having fine granularity, does not loose either resistance to oxidation or balance in conductivity, and furthermore, copper powder for conductive paste in which variations in shape and granularity are small and having a low concentration in oxygen content. The copper powder for conductive paste contains 0.07 to 10 atomic % Al inside each copper particle in the powder.