The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Feb. 07, 2008
Applicants:
Zhenfang Chen, Cupertino, CA (US);
Andreas Bibl, Los Altos, CA (US);
Paul A. Hoisington, Norwich, VT (US);
Inventors:
Zhenfang Chen, Cupertino, CA (US);
Andreas Bibl, Los Altos, CA (US);
Paul A. Hoisington, Norwich, VT (US);
Assignee:
FUJIFILM Dimatix, Inc., Lebanon, NH (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01D 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Techniques are provided for forming nozzles in a microelectromechanical device. The nozzles are formed in a layer prior to the layer being bonded onto another portion of the device. Forming the nozzles in the layer prior to bonding enables forming nozzles that have a desired depth and a desired geometry. Selecting a particular geometry for the nozzles can reduce the resistance to ink flow as well as improve the uniformity of the nozzles across the microelectromechanical device.