The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Dec. 03, 2007
Akira Okamura, Mie, JP;
Satoshi Nagai, Mie, JP;
Akira Okamura, Mie, JP;
Satoshi Nagai, Mie, JP;
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Abstract
Provided are a method of bonding a resin material (X) containing an oxymethylene-based polymer (A) and a resin material (Y), including: preparing an oxymethylene-based polymer composition (B) as resin material (Y), and resin material (X); or preparing resin material (X) and a resin material identical to resin material (X) or another resin material as resin material (Y), and providing polymer composition (B) between resin material (Y) and resin material (X); and heating: wherein polymer composition (B) has a melting point lower than that of polymer (A), and a difference in melting point between the composition and the polymer is smaller than 5° C.; and 50% or more of a peak area determined from a peak showing the molten state of polymer composition (B) measured by DSC is present in a temperature region lower than the peak temperature of polymer (A) by 5° C. or more; and a structure obtained thereby.