The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Oct. 10, 2008
Francis Chee-shuen Lee, Hsin-Chu, TW;
Wei-fu Lai, Hsin-Chu, TW;
Ming-ling Lee, Hsin-Chu, TW;
International United Technology Company, Ltd., Hsin-Chu, TW;
Abstract
A thermal inkjet printhead chip structure includes a substrate, an oxide layer formed on the substrate, at least one driver circuitry each including a source, a drain and a gate and formed on the substrate and further surrounded by the oxide layer, a dielectric layer, a buffer layer, a resistive layer and a conductive layer. The dielectric layer is formed on the driver circuitry and has openings formed therethrough to expose the source and drain. The buffer layer is formed on the dielectric layer, covering the source and drain and connected to the source and drain. The resistive layer is formed on the buffer layer and has at least one heating area. The resistive layer extends above the source and drain and is connected to the source and drain. The conductive layer is formed on the resistive layer and exposes the heating area. A manufacturing method also is provided.