The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2013
Filed:
Nov. 13, 2009
Tatsurou Ozawa, Kawasaki, JP;
Hidemi Nakajima, Koshigaya, JP;
Kozue Furuichi, Kasukabe, JP;
Hidehiko Kando, Yokohama, JP;
Shin Kataoka, Yokohama, JP;
Tatsurou Ozawa, Kawasaki, JP;
Hidemi Nakajima, Koshigaya, JP;
Kozue Furuichi, Kasukabe, JP;
Hidehiko Kando, Yokohama, JP;
Shin Kataoka, Yokohama, JP;
Toppan Printing Co., Ltd., Tokyo, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A contactless integrated circuit (IC) label has an IC chip and is capable of exchanging data with an external reading device without contact. The contactless IC label includes: a transparent label base material; an optical variable device formed on a lower surface of the label base material; a conductive layer bonded to and formed on a lower surface of the optical variable device, and configured to function as an antenna of the IC chip; a connecting layer electrically connected to the IC chip; an insulating layer formed between the conductive layer and the connecting layer, and configured to electrically couple the conductive layer and the connecting layer; and an impedance adjusting unit formed on at least the connecting layer of the conductive layer and the connecting layer, and configured to adjust impedances of the conductive layer and the IC chip.