The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2013

Filed:

Apr. 28, 2011
Applicants:

Takashi Kasai, Kusatsu, JP;

Yoshitaka Tsurukame, Kusatsu, JP;

Seung Kae Moon, Kyotanabe, JP;

Shinichi Terasaka, Kusatsu, JP;

Inventors:

Takashi Kasai, Kusatsu, JP;

Yoshitaka Tsurukame, Kusatsu, JP;

Seung Kae Moon, Kyotanabe, JP;

Shinichi Terasaka, Kusatsu, JP;

Assignee:

OMRON Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); H01L 21/00 (2006.01); H01L 29/84 (2006.01);
U.S. Cl.
CPC ...
Abstract

An acoustic sensor lengthens the portion of the beam portion not fixed with the anchor without lowering the strength of the beam portion and the supporting strength of the diaphragm. On an upper surface of a silicon substrate, a beam portion made of polysilicon is formed through a second sacrifice layer made of silicon dioxide film on an extended portion of a first sacrifice layer made of polysilicon. The extended portion is formed under a region excluding a distal end of the beam portion. The extended portion is removed by etching from a back chamber arranged in the silicon substrate to form a hollow portion in a region excluding the distal end of the lower surface of the beam portion, and then the second sacrifice layer is removed by etching. The second sacrifice layer remaining on the lower surface of the distal end of the beam portion forms an anchor.


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