The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2013
Filed:
Jul. 11, 2008
Yuan-chang Fann, Hsinchu County, TW;
Chun-mu Chen, Hsinchu County, TW;
Cheng-chou Wong, Hsinchu County, TW;
Chih-tsung Tu, Hsinchu, TW;
Jen-dong Hwang, Hsinchu, TW;
Yuan-Chang Fann, Hsinchu County, TW;
Chun-Mu Chen, Hsinchu County, TW;
Cheng-Chou Wong, Hsinchu County, TW;
Chih-Tsung Tu, Hsinchu, TW;
Jen-Dong Hwang, Hsinchu, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
The invention provides a metal thermal interface material (TIM) with through-holes in its body and/or zigzags or wave shapes on its border, which is suitable for use at thermal interfaces of a thermal conduction path from an integrated circuit die to its associated heat sink in a packaged microelectronic component. The invention also includes a thermal module and a packaged microelectronic component including the metal thermal interface material.