The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2013
Filed:
Jul. 29, 2009
Hajime Kobayashi, Kumagaya, JP;
Mayumi Nakasato, Ogaki, JP;
Ryosuke Usui, Ichinomiya, JP;
Yasuyuki Yanase, Gifu, JP;
Koichi Saito, Ogaki, JP;
Hajime Kobayashi, Kumagaya, JP;
Mayumi Nakasato, Ogaki, JP;
Ryosuke Usui, Ichinomiya, JP;
Yasuyuki Yanase, Gifu, JP;
Koichi Saito, Ogaki, JP;
Abstract
A semiconductor element mounted on an insulating resin layer formed on a wiring layer is sealed by a sealing resin. On the wiring layer, a protruding electrode protruding to the side of the semiconductor element and a protruding section are integrally formed with the wiring layer, respectively. The protruding electrode is electrically connected to an element electrode of the semiconductor element by penetrating the insulating resin layer. The protruding section is arranged to surround the semiconductor element along the four sides of the semiconductor element, and is embedded in the sealing resin up to a position above a section where the protruding electrode and the element electrode are bonded.