The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2013
Filed:
Sep. 21, 2007
Hwa Ja Kim, Ansan-si, KR;
Nam Young Kim, Ansan-si, KR;
Myung Hee Lee, Ansan-si, KR;
Kyoung BO Han, Ansan-si, KR;
Tae Kwang Kim, Ansan-si, KR;
Ji Seop SO, Ansan-si, KR;
Hwa Ja Kim, Ansan-si, KR;
Nam Young Kim, Ansan-si, KR;
Myung Hee Lee, Ansan-si, KR;
Kyoung Bo Han, Ansan-si, KR;
Tae Kwang Kim, Ansan-si, KR;
Ji Seop So, Ansan-si, KR;
Seoul Semiconductor Co., Ltd., Seoul, KR;
Abstract
A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.