The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8373091 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 12, 2013

Filed:

Aug. 23, 2006
Applicants:

Hiroyuki Moriuchi, Tokyo, JP;

Hideo Omori, Tokyo, JP;

Haruki Shimizu, Tokyo, JP;

Inventors:

Hiroyuki Moriuchi, Tokyo, JP;

Hideo Omori, Tokyo, JP;

Haruki Shimizu, Tokyo, JP;

Assignee:

DDK, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/38 (2006.01); H01R 43/16 (2006.01); H01R 13/03 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A microcontact according to the invention is less than 10 mm in length and composed of a conductive basis material, a base surface treatment layer formed thereon, and an upper surface treatment layer, and includes a contact portion, a terminal portion, and an intermediate portion formed over its entire circumference with exposed oxide surfaces of the base surface treatment layer. The exposed oxide surfaces are formed by irradiating the front and rear surfaces of the contact with laser beams at respective predetermined inclined angles to remove the upper surface treatment layer and simultaneously to oxidize the narrow base surface treatment layer exposed by the removal of the upper surface treatment layer. In this manner, the exposed oxide surfaces can be formed with a high accuracy in a simple manner for stopping solder rise at a predetermined position when the terminal portion of the microcontact is jointed to a substrate by soldering.


Find Patent Forward Citations

Moriuchi, Hiroyuki. (2013). Method of manufacturing a contact (U.S. Patent No. 8373091). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8373091

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…