The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2013

Filed:

May. 17, 2011
Applicants:

Kyoung IL Kang, Gyeonggi-do, KR;

Yong Goo Lee, Seoul, KR;

Jang Mook Lee, Chungcheongnam-do, KR;

Dong-il Lim, Gyeonggi-do, KR;

Inventors:

Kyoung il Kang, Gyeonggi-do, KR;

Yong Goo Lee, Seoul, KR;

Jang Mook Lee, Chungcheongnam-do, KR;

Dong-il Lim, Gyeonggi-do, KR;

Assignee:

Gigalane Co. Ltd., Gyeonggi-do, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A grounding unit for a high-frequency connector is provided, wherein the grounding unit may include a grounding unit body configured to be selectively fixed to the high-frequency connector; and a grounding fixation unit configured to be connected to the grounding unit body, to be in pressure contact with a grounding region of a printed circuit board (PCB) under elastic force applied in proportion to a thickness of the PCB, and to electrically connect the high-frequency connector to the grounding region.


Find Patent Forward Citations

Kang, Kyoung. (2013). Grounding unit for high-frequency connector and high-frequency connector module having the same (U.S. Patent No. 8371864). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8371864

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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