The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2013

Filed:

Apr. 08, 2010
Applicants:

Tai-wei Lin, Hsin-Chu, TW;

Jia-bin Huang, Hsin-Chu, TW;

Chi-chui Yun, Hsin-Chu, TW;

Inventors:

Tai-Wei Lin, Hsin-Chu, TW;

Jia-Bin Huang, Hsin-Chu, TW;

Chi-Chui Yun, Hsin-Chu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03B 21/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipation module includes a heat-absorbing unit, a first heat pipe, a second heat pipe, and a heat-dissipating unit. The heat-absorbing unit is adapted to contact the heat source thermally. The first heat pipe has a first heat-absorbing section being connected to the heat-absorbing unit and a first heat-dissipating section. The second heat pipe has a second heat-absorbing section being connected to the heat-absorbing unit and a second heat-dissipating section. The heat-dissipating unit includes a first fin assembly and a second fin assembly. The first heat-dissipating section is connected to the first fin assembly along a first extending direction, the second heat-dissipating section is connected to the second fin assembly along a second extending direction, the first extending direction and second extending direction are oblique to each other, and a part of the first fin assembly and a part of the second fin assembly are inset to each other.


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