The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2013
Filed:
Jan. 29, 2010
DO Hyung Kim, Yongin-si, KR;
Jung-mo Yang, Gwangmyeong-si, KR;
Hyun Jung Yoo, Seoul, KR;
Dong-yoon Seo, Yongin-si, KR;
In-young Park, Anyang-si, KR;
Do Hyung Kim, Yongin-si, KR;
Jung-Mo Yang, Gwangmyeong-si, KR;
Hyun Jung Yoo, Seoul, KR;
Dong-Yoon Seo, Yongin-si, KR;
In-Young Park, Anyang-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
Disclosed is an electronic device module including a module substrate having first and second electronic device pair portions. The first electronic device pair portion may include a first and a second contact pad area and a first via area between the first and second contact pad areas. The first electronic device pair portion may also include a first layer and a second layer. The first layer may include a plurality of first lines connecting a plurality of contact pads in the first contact pad area on one side of the module substrate to a plurality of vias. The second layer may include a plurality of second lines connecting a plurality of contact pads in the second contact pad area to a plurality of vias in the via area. The second layer may also include a plurality of third lines connecting the first and second electronic device pair portions.