The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2013
Filed:
Sep. 01, 2009
Stojan Kanev, Sacka, DE;
Frank Fehrmann, Baβlitz, DE;
Jens Fiedler, Dresden, DE;
Claus Dietrich, Sacka, DE;
Jörg Kiesewetter, Sacka, DE;
Stojan Kanev, Sacka, DE;
Frank Fehrmann, Baβlitz, DE;
Jens Fiedler, Dresden, DE;
Claus Dietrich, Sacka, DE;
Jörg Kiesewetter, Sacka, DE;
Other;
Abstract
The invention relates to a method for testing several electronic components () of a repetitive pattern under defined thermal conditions in a prober, which comprises a chuck () for holding the components () and special holding devices () for holding individual probes (). For testing, the components () are adjusted to a defined temperature, the probes () and a first electronic component () are positioned relative to each other by means of at least one positioning device, contact pads () of the electronic component () are subsequently contacted by the probes () so that the component () can be tested and then the positioning and the contacting can be repeated for testing another component () of the repetitive pattern. In order to shorten the test time for measurements at changing temperatures while ensuring reliable contacting of the components by using individual probes, a component () is positioned and contacted by a first positioning step which jointly affects all probes () first being carried out in an intermediate position, in the result of which the component () lies at a defined distance under the probe tips (), the position of each individual probe tip () being subsequently corrected by means of separate manipulators to the position of the corresponding contact pad () to be contacted with the particular probe tip () so that each probe tip () lies above a contact pad (), and the probe tips () further subsequently being brought into contact with the contact pads () of the component () by means of an advancing movement.