The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2013
Filed:
Dec. 03, 2010
Takatoshi Inokuchi, Kariya, JP;
Tadatoshi Asada, Anjo, JP;
Takatoshi Inokuchi, Kariya, JP;
Tadatoshi Asada, Anjo, JP;
Denso Corporation, Kariya, JP;
Abstract
A semiconductor package includes a metal plate, a power element, a lead frame having a die pad, a resin sheet having insulation properties, a control circuit that controls the power element, and a mold resin. The power element is mounted on the die pad, and the die pad is mounted on the metal plate via the resin sheet. The resin sheet is expanded including at least a lower surface of the die pad while the lower surface of the resin sheet is smaller than an surface of the metal plate, and the control circuit is arranged in a region on the metal plate, which region is other than the region where the power element is arranged.