The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2013
Filed:
Nov. 08, 2010
Jun-young Choi, Seoul, KR;
Kilsoo Kim, Hwaseong-si, KR;
Jun-Young Choi, Seoul, KR;
Kilsoo Kim, Hwaseong-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
Provided is a stacked package of a semiconductor device and a method of manufacturing the same. The stacked package of a semiconductor device may include at least one first semiconductor chip, at least one second semiconductor chip, at least one interposer between the at least one first semiconductor chip and the at least one second semiconductor chip, and a third semiconductor chip on the at least one first semiconductor chip. The at least one first semiconductor chip and the at least one second semiconductor chip may be configured to perform a first function and a second function and each may include a plurality of bonding pads. The third semiconductor chip may be configured to perform a third function which is different from the first and the second functions. The package may further include external connection leads may be configured to electrically connect the third semiconductor chip to the outside.