The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2013
Filed:
Feb. 09, 2011
Alexander Trusov, Irvine, CA (US);
Montgomery C. Rivers, Irvine, CA (US);
Sergei A. Zotov, Irvine, CA (US);
Andrei M. Shkel, McLean, VA (US);
Alexander Trusov, Irvine, CA (US);
Montgomery C. Rivers, Irvine, CA (US);
Sergei A. Zotov, Irvine, CA (US);
Andrei M. Shkel, McLean, VA (US);
The Regents of the University of California, Oakland, CA (US);
Abstract
An apparatus is fabricated with a plurality of semiconductor-device substrates and/or MEMS substrates with micromachined sensors, circuits, transducers, and/or MEMS devices fabricated on the plurality of substrates. A plurality of flexible hinges couple the plurality of substrates into a substantially flat two dimensional foldable assembly. Electrical interconnects coupled to the sensors, circuits, transducers, and/or MEMS devices extend other ones of the plurality of substrates. The foldable assembly of substrates is assembled or folded into a three dimensional polyhedral structure with the plurality of substrates configured in three dimensions to form defined relative orientations in space with respect to each other. The invention includes a wafer scale method of fabricating the apparatus.