The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2013
Filed:
Jul. 30, 2008
Chien-chun LU, Danshuei Township, Taipei County, TW;
Chia-tai Kuo, Taipei, TW;
Chen-peng Hsu, Kaohsiung, TW;
Hung-lieh HU, Hsinchu, TW;
Chien-jen Sun, Jhubei, TW;
Chien-Chun Lu, Danshuei Township, Taipei County, TW;
Chia-Tai Kuo, Taipei, TW;
Chen-Peng Hsu, Kaohsiung, TW;
Hung-Lieh Hu, Hsinchu, TW;
Chien-Jen Sun, Jhubei, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A light emitting device and a fabricating method thereof are described. The light emitting device includes a substrate, a light emitting chip, a tubular structure, and a fluorescent conversion layer. The tubular structure is formed on a surface of the substrate. The light emitting chip is disposed on the surface of the substrate and is surrounded by the tubular structure. The fluorescent conversion layer is disposed in the tubular structure and covers the light emitting chip. A ratio of a maximal vertical thickness and a maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 0.1 and 10. A distance for the light ray to pass through the fluorescent conversion layer is controlled by using the tubular structure, so as to solve a problem of the conventional art that fluorescent powder coating package technique results in non-uniform color temperature of the emitted light.