The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8368097 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 05, 2013

Filed:

Jul. 13, 2007
Applicants:

Hyun Jun Kim, Suwon, KR;

Chang Hwan Choi, Seongnam, KR;

Jong Myeon Lee, Gwacheon, KR;

Dong Woohn Kim, Suwon, KR;

Won Ha Moon, Suwon, KR;

Inventors:

Hyun Jun Kim, Suwon, KR;

Chang Hwan Choi, Seongnam, KR;

Jong Myeon Lee, Gwacheon, KR;

Dong Woohn Kim, Suwon, KR;

Won Ha Moon, Suwon, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
Abstract

An LED package comprises a frame having a concave portion formed in the center thereof; one or more LED chips mounted on the bottom surface of the concave portion; and a lens filled in the concave portion, the lens having an upper surface formed of continuous prismatic irregularities forming concentric circles.


Find Patent Forward Citations

Kim, Hyun. (2013). Light emitting diode package and method of manufacturing the same (U.S. Patent No. 8368097). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8368097

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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