The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2013
Filed:
Aug. 04, 2003
Roel Daamen, Leuven, BE;
Viet Nguyen Hoang, Leuven, BE;
Romano Julma Oscar Maria Hoofman, Leuven, BE;
Greja Johanna Adriana Maria Verheijden, Leuven, BE;
Roel Daamen, Leuven, BE;
Viet Nguyen Hoang, Leuven, BE;
Romano Julma Oscar Maria Hoofman, Leuven, BE;
Greja Johanna Adriana Maria Verheijden, Leuven, BE;
NXP B.V., Eindhoven, NL;
Abstract
The present invention relates to a method for fabrication of in-laid metal interconnects. The method comprises the steps of providing a substrate with a dielectric material on top thereof, depositing a protection layer on top of the dielectric material, depositing a sacrificial layer on top of the protection layer, the sacrificial layer having a mechanical strength that is lower than the mechanical strength of the protection layer, making an opening) through the sacrificial layer, through the protection layer and into the dielectric material, depositing a barrier layer in the opening and on the sacrificial layer, depositing metal material on the barrier layer, the metal material filling the opening, removing portions of the metal material existing beyond the opening by means of polishing, and removing the barrier layer and the sacrificial layer in one polishing step.