The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2013

Filed:

Jun. 02, 2011
Applicants:

Gerald K. Bartley, Rochester, MN (US);

Charles L. Johnson, Fort Myers, FL (US);

John E. Kelly, Iii, Poughquag, NY (US);

David R. Motschman, Rochester, MN (US);

Inventors:

Gerald K. Bartley, Rochester, MN (US);

Charles L. Johnson, Fort Myers, FL (US);

John E. Kelly, III, Poughquag, NY (US);

David R. Motschman, Rochester, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 21/48 (2006.01); H01L 23/34 (2006.01); H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 23/40 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
Abstract

The exemplary embodiments of the present invention provide a method and apparatus for enhancing the cooling of a chip stack of semiconductor chips. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes creating a cavity in a second side of the first chip between the connectors and filling the cavity with a thermal material. The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes wherein portions of a second side of the first chip between the connectors is removed to provide a cavity in which a thermal material is placed.


Find Patent Forward Citations

Loading…