The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2013
Filed:
Apr. 28, 2011
Yasuhiro Yamaji, Ibaraki, JP;
Tokihiko Yokoshima, Ibaraki, JP;
Masahiro Aoyagi, Ibaraki, JP;
Hiroshi Nakagawa, Ibaraki, JP;
Katsuya Kikuchi, Ibaraki, JP;
Yasuhiro Yamaji, Ibaraki, JP;
Tokihiko Yokoshima, Ibaraki, JP;
Masahiro Aoyagi, Ibaraki, JP;
Hiroshi Nakagawa, Ibaraki, JP;
Katsuya Kikuchi, Ibaraki, JP;
Abstract
An electrode connection structure of a semiconductor chip is provided to realize a highly reliable electrical connection with low stress without using a bump. A conductive member may be used for such an electrode connection structure. A semiconductor device is provided wherein semiconductor chips are arranged in layers without providing the semiconductor chips with a through via, and a method is provided for manufacturing such a semiconductor device. A part or all of the surface of a horizontal recess, which is formed in an adhesive layer arranged between a first electrode of a lower layer and a second electrode of an upper layer, is provided with a conductive member for connecting the first electrode and the second electrode.