The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2013
Filed:
Feb. 10, 2009
Daisuke Okamoto, Tokyo, JP;
Kenichi Nishi, Tokyo, JP;
Junichi Fujikata, Tokyo, JP;
Jun Ushida, Tokyo, JP;
Daisuke Okamoto, Tokyo, JP;
Kenichi Nishi, Tokyo, JP;
Junichi Fujikata, Tokyo, JP;
Jun Ushida, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
Provided is a semiconductor optical interconnection device capable of transmitting signals between laminated semiconductor chips in a structure where semiconductor chips highly functionalized by being bonded to an optical interconnection chip are laminated. The semiconductor optical interconnection device includes a semiconductor chipand an optical interconnection chip. The optical interconnection chipincludes an optical element formed thereon (for instance, a photo-sensitive element, a luminous element, or an optical modulator) which has a function relating to signal conversion between light and electricity. The semiconductor chipincludes a transmission section(for instance, a coil or an inductor) to transmit signals in a non-contact manner, and a connection section(for instance, a bump) to electrically connect with the optical element.