The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2013
Filed:
Sep. 12, 2011
Tae-ho Kang, Seoul, KR;
Jin-ho Kim, Cheonan-si, KR;
Bo-seong Kim, Seoul, KR;
Samsung Electronics Co., Ltd., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
Provided are a multi-chip package and a method of manufacturing the same, which can facilitate wire bonding even when an upper chip is larger than a lower chip or overhangs a lower chip. A multi-chip package includes a substrate having first and second bonding pads on a top surface thereof, a first chip connected to the first bonding pads on the substrate, an insulating layer formed on the substrate so as to surround lateral surfaces of the first chip, a set of openings formed in the insulating layer so as to expose the second bonding pads, and a second chip formed on the insulating layer and the first chip, the second chip having a larger area than the first chip and connected to the second bonding pads using wires that pass through the second openings.