The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2013
Filed:
Jun. 16, 2008
IN Kwon Ju, Daejeon, KR;
IN Bok Yom, Daejeon, KR;
In Kwon Ju, Daejeon, KR;
In Bok Yom, Daejeon, KR;
Electronics and Telecommunications Research Institute, Daejeon, KR;
Abstract
An ultra wideband hermetically sealed surface mount package for a microwave monolithic integrated circuit (MMIC) is provided including: an integrated circuit; a package body being mounted with the integrated circuit and comprising a plurality of first dielectrics formed in a multilayer, a first line unit mounted to a circuit substrate and is electrically connected with an external circuit, a second line unit upwardly extended from the first line unit and is electrically connected with the first line unit, a third line unit extended to the right angle from the second line unit and is electrically connected with the second line unit, and a bonding unit that electrically connects the third line unit and the mounted integrated circuit; and a package cover being formed on the package body to seal the integrated circuit and comprising a plurality of second dielectrics formed in a multilayer.