The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2013
Filed:
Mar. 24, 2009
Applicants:
Voonyee Ho, Ibaraki, JP;
Katsutoshi Kamei, Ibaraki, JP;
Inventors:
Voonyee Ho, Ibaraki, JP;
Katsutoshi Kamei, Ibaraki, JP;
Assignee:
Nitto Denko Corporation, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
Abstract
Ground traces are formed to sandwich a write wiring trace. Ground walls are formed on the ground traces. A ground cover is formed so as to couple upper ends of the ground walls. Thus, the ground traces, the ground walls and the ground cover are positioned in a region above and on both sides of the write wiring trace to surround the write wiring trace.
Ho, Voonyee. (2013). Printed circuit board and method of manufacturing the same (U.S. Patent No. 8362365). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8362365
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile