The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2013
Filed:
Apr. 23, 2008
Katsuhiko Funaki, Sunnyvale, CA (US);
Etsuo Ohkawado, Chiba, JP;
Kousuke Hirota, Urayasu, JP;
Syuji Tahara, Ichihara, JP;
Katsuhiko Funaki, Sunnyvale, CA (US);
Etsuo Ohkawado, Chiba, JP;
Kousuke Hirota, Urayasu, JP;
Syuji Tahara, Ichihara, JP;
Mitsui Chemicals, Inc., Tokyo, JP;
Abstract
A photosensitive resin composition which is effective in avoiding troubles in the step of plating with various metals in printed wiring board production, such as under-film metal deposition and film peeling, and which forms a wiring-protecting film excellent in adhesion, flexibility, insulation reliability, and heat resistance. The photosensitive resin composition comprises (A) a carboxylated polymer, (B) a compound having at least two photopolymerizable unsaturated double bonds, (C) a photopolymerization initiator, and (D) a nitrogen compound represented by a specific feature.