The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2013
Filed:
Jan. 05, 2012
Forming mold or electroforming mother die having release layer and method for manufacturing the same
Tomoya Hidaka, Ichihara, JP;
Norifumi Nakamoto, Ichikawa, JP;
Yoshitaka Fujita, Ichihara, JP;
Nippon Soda Co., Ltd., Tokyo, JP;
Abstract
A forming mold or electroforming mother die including a mold or mother die, and a release layer composed of an organic thin film on a mold surface or mother die surface which is formed by contacting the mold or mother die with an organic solvent solution including a silane surfactant represented by formula [1]R—Si—X  [1]where R represents an optionally substituted hydrocarbon group or halogenated hydrocarbon having 1 to 20 carbon atoms, or a hydrocarbon group or a halogenated hydrocarbon group having a linking group which has 1 to 20 carbon atoms, X represents a hydroxyl group, a halogen atom, an alkoxy group having 1 to 6 carbon atoms, or an acyloxy group, and n represents an integer of 1 to 3; and a catalyst capable of interacting with the silane surfactant, and a production method thereof.