The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2013

Filed:

Jan. 10, 2008
Applicants:

Toshio Fukuda, Kanagawa, JP;

Akihiro Nomoto, Kanagawa, JP;

Inventors:

Toshio Fukuda, Kanagawa, JP;

Akihiro Nomoto, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 41/46 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of forming a pattern and a method of producing an electronic element with which a fine and precise pattern is stably formed are provided. Each of the method of forming a pattern and the method of producing an electronic element includes a step of forming an electrically conductive film D by applying a liquid composition onto a first plate; a step of forming an electrically conductive pattern D' on the first plateby pressing a second plateonto a surface side of the first plate, on which the electrically conductive film D is formed, to transfer an unwanted pattern of the electrically conductive film D to top faces of projectionsof the second plate, thereby removing the unwanted pattern; and a step of transferring the electrically conductive pattern D′ by pressing the surface side of the first plate, on which the electrically conductive pattern D′ is formed, onto a surface of a transfer-receiving substrate, wherein when a surface tension of the surface of the first plate, onto which the liquid composition is applied, is represented by α, a dynamic surface tension of the liquid composition at 100 msec measured by a maximum bubble pressure method is represented by β, and a surface tension of the top faces of the projectionsof the second plateis represented by γ, the composition of the liquid composition or a material of the surface of the first plateor the second plateis set so as to satisfy γ>α≧β.


Find Patent Forward Citations

Loading…