The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2013

Filed:

Oct. 22, 2009
Applicants:

Hiroaki Takano, Tsuchiura, JP;

Yoshiki Yamamoto, Tsukuba, JP;

Koichi Kotoku, Inashiki-gun, JP;

Chingping Tong, Tsuchiura, JP;

Inventors:

Hiroaki Takano, Tsuchiura, JP;

Yoshiki Yamamoto, Tsukuba, JP;

Koichi Kotoku, Inashiki-gun, JP;

Chingping Tong, Tsuchiura, JP;

Assignee:

Hitachi Cable, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22F 1/08 (2006.01); C22C 9/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A copper alloy material having: 1.0 to 5.0 mass % of Ni; 0.2 to 1.0 mass % of Si; 1.0 to 5.0 mass % of Zn; 0.1 to 0.5 mass % of Sn; 0.003 to 0.3 mass % of P; and the balance consisting of Cu and an unavoidable impurity. The mass ratio between Ni and each of Si, Zn and Sn is to be Ni/Si=4 to 6, Zn/Ni=0.5 or more, and Sn/Ni=0.05 to 0.2.


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