The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2013
Filed:
Jul. 01, 2010
Richard Henry Bossi, Renton, WA (US);
Kevin R. Housen, Tacoma, WA (US);
Richard Henry Bossi, Renton, WA (US);
Kevin R. Housen, Tacoma, WA (US);
The Boeing Company, Chicago, IL (US);
Abstract
A method and apparatus for testing a bond interface is provided. An initial wave is transmitted into a first end of a first material. The first material is connected to a second material by an adhesive at a bond interface. The first material is dissimilar to the second material. The initial wave splits into a first wave and a second wave at the bond interface. Parameters are changed so a first wave travels through the first material to the first end of the first material and back to the bond interface in a first amount of time and the second wave travels through the second material to a second end of the second material and back to the bond interface in a second amount of time. The first amount of time is substantially equal to the second amount of time. A tension is obtained in the adhesive at the bond interface.