The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2013

Filed:

Jul. 29, 2009
Applicants:

Kuo-len Lin, Wugu Township, Taipei County, TW;

Chen-hsiang Lin, Wugu Township, Taipei County, TW;

Ken Hsu, Wugu Township, Taipei County, TW;

Chih-hung Cheng, Wugu Township, Taipei County, TW;

Inventors:

Kuo-Len Lin, Wugu Township, Taipei County, TW;

Chen-Hsiang Lin, Wugu Township, Taipei County, TW;

Ken Hsu, Wugu Township, Taipei County, TW;

Chih-Hung Cheng, Wugu Township, Taipei County, TW;

Assignees:

CPUmate Inc., New Taipei, TW;

Golden Sun News Techniques Co., Ltd., New Taipei, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23P 15/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing a heat sink includes providing a heat-conducting base with a plurality of open troughs; providing a plurality of heat pipes, each having a heat-absorbing section and a heat-releasing section extending from the heat-absorbing section; the heat-absorbing section being accommodated in one open trough to have the heat pipe engaged with the heat-conducting base; providing a plurality of heat-dissipating fins, each of the heat-dissipating fins having a lower plate and an upper plate extending from the lower plate, the upper plate being folded to form an overlapping portion attached on the lower plate; forming a through-hole in the lower plate and the upper plate at the overlapping portion; and penetrating the through-holes of the heat-dissipating fins by the heat-releasing section of the heat pipe. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink.


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