The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8358514 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 22, 2013

Filed:

Oct. 15, 2009
Applicants:

Atsushi Kashiwazaki, Anjo, JP;

Yasumitsu Tanaka, Inazawa, JP;

Inventors:

Atsushi Kashiwazaki, Anjo, JP;

Yasumitsu Tanaka, Inazawa, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

In an electronic control device, an electrically-conductive adhesive is arranged on an outer edge portion of a first surface of a circuit board as a stress reducing portion for reducing stress of the circuit board received by a molding resin. An elastic modulus of the electrically-conductive adhesive is lower than that of the circuit board. The electrically-conductive adhesive is covered by an adhesion improving member. When peeling stress is applied to the circuit board from the molding resin, the electrically-conductive adhesive and the adhesion improving member receive the peeling stress to be deformed. Therefore, the peeling stress to the circuit board is reduced.


Find Patent Forward Citations

Kashiwazaki, Atsushi. (2013). Electronic control device (U.S. Patent No. 8358514). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8358514

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