The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2013
Filed:
Oct. 28, 2010
Mikkel Block Toftloekke, Brønderslev, DK;
Christopher Ratliff, Santa Cruz, CA (US);
Peter Lykke, Aalborg, DK;
Todd Berk, Burbank, WA (US);
André Sloth Eriksen, Morgan Hill, CA (US);
Mikkel Block Toftloekke, Brønderslev, DK;
Christopher Ratliff, Santa Cruz, CA (US);
Peter Lykke, Aalborg, DK;
Todd Berk, Burbank, WA (US);
André Sloth Eriksen, Morgan Hill, CA (US);
Asetek A/S, Bronderslev, DK;
Abstract
A liquid cooling system includes a monolith that is configured to be coupled to a motherboard of the computer. The monolith may be monolithic planar body having a first surface and an opposite second surface, and may include a heat absorption region and a heat dissipation region. The heat absorption region may be at least one location on the monolith that is configured to be in thermal contact with a heat generating component of the motherboard, and the heat dissipation region may be at least one location on the monolith where a liquid-to-air heat exchanger is attached to the monolith. The liquid cooling system may also include a channel extending on the second surface of the monolith and a pump that is configured to circulate the liquid coolant through the channel. The channel may be a trench on the second surface of the monolith that is configured to circulate a liquid coolant between the heat absorption region and the heat dissipation region.