The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2013
Filed:
Apr. 29, 2009
Applicants:
Makoto Imanishi, Osaka, JP;
Yoshihiro Tomura, Osaka, JP;
Kentaro Kumazawa, Osaka, JP;
Inventors:
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electronic component, in which the outer perimeter portion of a component () is surrounded with a first sealing resin (), a second sealing resin () is filled within the periphery of the first sealing resin (), the component () and a board () are electrically connected by a wire (), the edge, in the vicinity of which the wire () passes, of the outer perimeter edge portions of the component () is formed to be a chamfered oblique surface (), and the wire () is provided to extend to the board () along the oblique surface (). By this means, the overall height of the electronic component can be kept low.