The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8356407 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 22, 2013

Filed:

Aug. 30, 2006
Applicants:

Nicole Anderson, Midland, MI (US);

Dimitris Elias Katsoulis, Midland, MI (US);

Bizhong Zhu, Midland, MI (US);

Inventors:

Nicole Anderson, Midland, MI (US);

Dimitris Elias Katsoulis, Midland, MI (US);

Bizhong Zhu, Midland, MI (US);

Assignee:

Dow Corning Corporation, Midland, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08J 5/18 (2006.01); B32B 27/00 (2006.01); C09D 183/04 (2006.01); B29C 41/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Films and electronic devices can be released from metallic substrates by: (i) applying a coating of a polysilsesquioxane resin to a metallic substrate, (ii) heating the coated metallic substrate to a temperature sufficient to cure the polysilsesquioxane resin, (iii) applying a polymeric film to the cured coating on the metallic substrate, (iv) further heating the coated metallic substrate to a temperature sufficient to cure the polymeric film, (v) optionally fabricating electronic devices on the polymeric film, and (vi) releasing the polymeric film from the metallic substrate.


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Anderson, Nicole. (2013). Method of releasing high temperature films and/or devices from metallic substrates (U.S. Patent No. 8356407). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8356407

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