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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8355809 B1

PDFFull Text
Date of Patent:
Jan. 15, 2013

Filed:

Jun. 25, 2007

System and method for designing a die to yield a desired coating uniformity

Applicants:

Robert A. Yapel, Oakdale, MN (US);

Robert B. Secor, Stillwater, MN (US);

Michael J. Tichy, Henning, MN (US);

Bruce D. Shalles, River Falls, WI (US);

Charles N. Devore, Hugo, MN (US);

Jennifer L. Trice, Hugo, MN (US);

James M. Nelson, Woodbury, MN (US);

Andrzej P. Jaworski, Woodbury, MN (US);

William R. Dudley, Geneseo, NY (US);

Keith R. Bruesewitz, River Falls, WI (US);

Inventors:

Robert A. Yapel, Oakdale, MN (US);

Robert B. Secor, Stillwater, MN (US);

Michael J. Tichy, Henning, MN (US);

Bruce D. Shalles, River Falls, WI (US);

Charles N. DeVore, Hugo, MN (US);

Jennifer L. Trice, Hugo, MN (US);

James M. Nelson, Woodbury, MN (US);

Andrzej P. Jaworski, Woodbury, MN (US);

William R. Dudley, Geneseo, NY (US);

Keith R. Bruesewitz, River Falls, WI (US);

Assignee:

3M Innovative Properties Company, St. Paul, MN (US);

Attorneys:

Douglas B. Little

James A. Baker

Primary Examiner:

Carlos Ortiz Rodriguez

Int. Cl.
CPC ...
G06F 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Computer implemented method for making a die includes: selecting coating uniformity required to produce a particular coated product with the die and a value for one or more dimensions of the die; determining (using a mathematical model determined by regression analysis) total indicated run-out (TIR) of a die surface and dimensions of the die not having a user specified value; and machining die part or parts to the determined TIR and dimensions. A thermal treatment process for reducing the number of finishing (e.g., grinding) cycles needed to produce a desired die flatness is provided. A coating fluid rheological characteristic can be an input to the method.

Find Patent Forward Citations

Yapel, Robert. (2013). System and method for designing a die to yield a desired coating uniformity (U.S. Patent No. 8355809). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8355809

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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