The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2013
Filed:
Aug. 18, 2010
Sven Berberich, Spardorf, DE;
Sven Berberich, Spardorf, DE;
Semikron Elektronik GmbH & Co., KG, Nürnberg, DE;
Abstract
A layer assemblage for a semiconductor chip having a chip body for producing a soldering connection for the chip. The assemblage is provided on a side of a chip body formed from a semiconducting material, wherein the layer assemblage is formed from a plurality of sequential metal layers which follow one above another and are produced by means of a physical coating method, and wherein a solderable soldering layer is provided between a noble metal layer situated at a surface of the layer assemblage and the chip body. In order to avoid an undesired penetration of a solder through the layer assemblage the soldering layer has at least one internal interface formed by an interruption of the coating method.